PBF-LB/M
Powder Bed Fusion – Laser Beam / Metal
Laser-based powder bed process for layer-by-layer production of highly complex metal components. (Brand names such as SLM or DMLS historically belong to this family.)
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Technology & Knowledge
Industrial Metal 3D Printing Technologies
Structured overview of the most important technologies for industrial metal additive manufacturing.
Architecture
Technology Classification
Metal additive manufacturing is structured according to ISO/ASTM 52900 into clear process families. Here you will find an unambiguous classification of the most important industrial processes.
ISO/ASTM 52900 Main Family
POWDER BED FUSION (PBF)
ISO/ASTM 52900 main family: Layer-by-layer construction by selectively melting a powder bed using thermal energy. Primarily suited for small to medium-sized, highly complex components.
PBF-EB/M
Powder Bed Fusion – Electron Beam / Metal
Powder bed process in which an electron beam fuses metal powder under vacuum. (Commercially often referred to as Electron Beam Melting / EBM.)
View DetailsISO/ASTM 52900 Main Family
DIRECTED ENERGY DEPOSITION (DED)
ISO/ASTM 52900 main family: Process using focused thermal energy to fuse materials as they are deposited. Ideal for large parts and repair applications.
DED-LB/M (Powder-fed)
Laser-based Directed Energy Deposition (Powder-fed)
DED process in which metal powder feedstock is blown via a nozzle directly into the laser-generated melt pool.
View DetailsDED-LB/M (Wire-fed)
Laser-based Directed Energy Deposition (Wire-fed)
DED process in which metal wire feedstock is melted by a laser beam. (Systems such as Meltio fall exactly into this category.)
View DetailsDED-EB/M
Electron Beam-based Directed Energy Deposition
DED process using an electron beam in vacuum as the energy source, typically combined with wire feedstock (EBAM).
View DetailsDED-Arc/M (WAAM)
Arc-based Directed Energy Deposition / WAAM
DED process using an electric arc to melt metal wire. WAAM (Wire Arc Additive Manufacturing) is the most widely known and commercially important variant.
View DetailsISO/ASTM 52900 Main Family
BINDER JETTING (BJT)
ISO/ASTM 52900 main family: A liquid binder is selectively deposited onto a powder bed. For metal, BJT requires downstream debinding and sintering processes.
BJT (Metal)
Metal Binder Jetting
A BJT family process in which metal powder layers are bound by a liquid binder. The resulting green part must be debound and sintered.
View DetailsISO/ASTM 52900 Main Family
MATERIAL EXTRUSION (MEX)
ISO/ASTM 52900 main family: Material is selectively extruded through a nozzle or orifice. In metal AM, primarily realised via polymer-bound metal filaments (Metal FFF), followed by sintering.
MEX (Metal)
Material Extrusion / Metal FFF
ISO/ASTM Material Extrusion applied to metal. Filaments or rods of metal-polymer composite (MIM feedstock) are extruded, then debound and sintered. Often called Metal FFF.
View DetailsISO/ASTM 52900 Main Family
MATERIAL JETTING (MJT)
ISO/ASTM 52900 main family: Droplets of build material are selectively deposited. In metal 3D printing, primarily realised via nanoparticle-ink jetting (Nanoparticle Jetting).
MJT (Metal)
Material Jetting / Nanoparticle Jetting
ISO/ASTM Material Jetting family. In metal AM, nanoparticle-laden inks are jetted from print heads and dried. (Significantly less widespread than PBF or DED.)
View DetailsISO/ASTM 52900 Main Family
SHEET LAMINATION (SHL)
ISO/ASTM 52900 main family: Sheet or foil material is bonded layer by layer, often followed by subtractive machining.
SHL (UAM)
Sheet Lamination / Ultrasonic Additive Manufacturing
ISO/ASTM Sheet Lamination family. Thin metal foils or sheets are bonded layer by layer via ultrasonic friction welding and trimmed by CNC.
View DetailsISO/ASTM 52900 Main Family
VAT PHOTOPOLYMERIZATION (VPP)
ISO/ASTM 52900 main family: Liquid photopolymer is selectively cured by light. Of limited relevance for direct industrial metal AM (primarily applicable for ceramic-metallic slurries or investment-casting patterns).
VPP (Metall-indirekt)
Vat Photopolymerization (SLA/DLP for investment casting / slurry)
ISO/ASTM Vat Photopolymerization family. Liquid resin is cured by UV light. For industrial metal AM, VPP is primarily an indirect process (producing patterns for investment casting).
View DetailsComplementary Technologies (Non-ISO)
SOLID-STATE PROCESSES (COMPLEMENTARY)
Processes outside the 7 ISO/ASTM main families — no melt metallurgy involved (kinetic energy / friction bonding).
CSAM (Cold Spray)
Cold Spray Additive Manufacturing
Complementary solid-state process (not part of the 7 ISO/ASTM main families). Metal powder is accelerated to supersonic velocity and bonds to a substrate via plastic deformation — no melting occurs.
View DetailsAFSD
Additive Friction Stir Deposition
Complementary solid-state process. A solid metal rod (feedstock) is plasticised (not melted) by frictional heat and pressure and deposited layer by layer.
View DetailsComplementary Technologies (Non-ISO)
HYBRID ADDITIVE MANUFACTURING
Combination of additive processes (typically DED) and subtractive CNC machining in a single machine or tightly coupled process chain.
Hybrid (DED + CNC)
Hybrid Additive Manufacturing (DED + CNC)
Combined machine class (not an independent ISO family) integrating an additive process (typically DED-LB/M) directly into a 5-axis CNC machining centre.
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